SSP-02 Dual-Interface Module Preparation Machine

SSP-02 Dual-Interface Module Preparation Machine

Dimension: L2030*W885*H1750mm
Weight: 460Kg
Power: AC380V ,50/60Hz
Rated Power: 3.7KW
Air Pressure: 6kg/cm2
Air Consumption: 90LMin
Control Type: PLC+servomotor system
Production Speed: 3200pcs/Hour



+ Automatically release module.

+ Automatcally level tin bump. 

+ Automatically glue tape punching & laminating.

+ Automatic alam and will pause the machine if hot melt adhesive and chips used up.

+ Manified 50 times of monitor to ensure good condition of welding and glue tape lamination.

+ Accurate and stable by using servo system to convey.

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