Features

+ SICP-06 is used to do embedding process. For high module

embedding, this machine is a good choice.

+ Automatically identify qualified cards and unqualfied cards,

and collect them separately.

+ Cooling system on hot soldering station can use any hot melt

adhesive without making card deformed.

+ Non-iled card will be automatically identfed by cavity

sensor to avoid embedding.

+ Automatic divide good card from defective cards.

+ Automatic alarm when chips run out & automatic put in chips

and defective module will be collected into waste box.

+ Easy operation and maintenance.