+ SICP-06 is used to do embedding process. For high module
embedding, this machine is a good choice.
+ Automatically identify qualified cards and unqualfied cards,
and collect them separately.
+ Cooling system on hot soldering station can use any hot melt
adhesive without making card deformed.
+ Non-iled card will be automatically identfed by cavity
sensor to avoid embedding.
+ Automatic divide good card from defective cards.
+ Automatic alarm when chips run out & automatic put in chips
and defective module will be collected into waste box.
+ Easy operation and maintenance.